公开(公告)号：US11328411B2

公开(公告)日：2022-05-10

申请号：US17246034

申请日：2021-04-30

Applicant: KLA Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Xiaochun Li ,  James A. Smith ,  Eugene Shifrin ,  Qing Luo ,  Michael Cook ,  Wei Si ,  Leon Yu ,  Bjorn Brauer ,  Nurmohammed Patwary ,  Ramon Ynzunza ,  Neil Troy

IPC: G06T7/00 ,  G01N21/88 ,  G01N21/95

Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) configured for performing at least one repeater defect detection step in front-end processing during an inspection process performed on a wafer having features printed in a lithography process using a reticle. The at least one repeater defect detection step performed in the front-end processing includes identifying any defects detected at corresponding locations in two or more test images by double detection and any defects detected by stacked defect detection as first repeater defect candidates. One or more additional repeater defect detections may be performed on the first repeater defect candidates to generate final repeater defect candidates and identify defects on the reticle from the final repeater defect candidates.

公开(公告)号：US20210342992A1

公开(公告)日：2021-11-04

申请号：US17246034

申请日：2021-04-30

Applicant: KLA Corporation

Inventor： Hong Chen ,  Kenong Wu ,  Xiaochun Li ,  James A. Smith ,  Eugene Shifrin ,  Qing Luo ,  Michael Cook ,  Wei Si ,  Leon Yu ,  Bjorn Brauer ,  Nurmohammed Patwary ,  Ramon Ynzunza ,  Neil Troy

IPC: G06T7/00 ,  G01N21/88 ,  G01N21/95

Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) configured for performing at least one repeater defect detection step in front-end processing during an inspection process performed on a wafer having features printed in a lithography process using a reticle. The at least one repeater defect detection step performed in the front-end processing includes identifying any defects detected at corresponding locations in two or more test images by double detection and any defects detected by stacked defect detection as first repeater defect candidates. One or more additional repeater defect detections may be performed on the first repeater defect candidates to generate final repeater defect candidates and identify defects on the reticle from the final repeater defect candidates.