公开(公告)号：US20190108630A1

公开(公告)日：2019-04-11

申请号：US16206691

申请日：2018-11-30

Applicant: KLA-Tencor Corporation

Inventor： Jason Z. Lin ,  Allen Park ,  Ellis Chang ,  Richard Wallingford ,  Songnian Rong ,  Chetana Bhaskar

IPC: G06T7/00

Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.

公开(公告)号：US11295438B2

公开(公告)日：2022-04-05

申请号：US16206691

申请日：2018-11-30

Applicant: KLA-Tencor Corporation

Inventor： Jason Z. Lin ,  Allen Park ,  Ellis Chang ,  Richard Wallingford ,  Songnian Rong ,  Chetana Bhaskar

IPC: G06T7/00

Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.

公开(公告)号：US10192303B2

公开(公告)日：2019-01-29

申请号：US14076350

申请日：2013-11-11

Applicant: KLA-Tencor Corporation

Inventor： Jason Z. Lin ,  Allen Park ,  Ellis Chang ,  Richard Wallingford ,  Songnian Rong ,  Chetana Bhaskar

IPC: G06K9/00 ,  G06T7/00

Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.

公开(公告)号：US20140153814A1

公开(公告)日：2014-06-05

申请号：US14076350

申请日：2013-11-11

Applicant: KLA-Tencor Corporation

Inventor： Jason Z. Lin ,  Allen Park ,  Ellis Chang ,  Richard Wallingford ,  Songnian Rong ,  Chetana Bhaskar

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G06T2207/30148

Abstract: Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a second wafer die to identify an occurrence of one or more defects in the first or second wafer die, comparing a first block to a second block to identify an occurrence of one or more defects in the first or second blocks and comparing a first cell to a second cell to identify an occurrence of one or more defects in the first or second cells.

Abstract translation: 混合模式包括接收包括晶片的选定区域的一个或多个图像的检查结果，一个或多个图像包括一个或多个晶片管芯，其包括一组重复块，该组重复块是一组重复的单元。 此外，混合模式检查包括调整一个或多个图像的像素尺寸以将每个单元映射到块，并将其死亡到整数个像素。 此外，混合模式检查包括将第一晶片管芯与第二晶片管芯进行比较，以识别第一或第二晶片管芯中的一个或多个缺陷的发生，将第一块与第二块进行比较以识别一个或多个 第一或第二块中的缺陷，并且将第一细胞与第二细胞进行比较以识别第一或第二细胞中的一个或多个缺陷的发生。