公开(公告)号：US10393647B1

公开(公告)日：2019-08-27

申请号：US14578245

申请日：2014-12-19

Applicant: KLA-Tencor Corporation

Inventor： Qiang Jimmy Zhao ,  Liequan Lee ,  Jonathan Ian Iloreta ,  Hong Qiu ,  Leonid Poslavsky

IPC: G01N21/25

Abstract: A system, method, and computer program product are provided for automatically determining a parameter causing an abnormal semiconductor metrology measurement. In use, an abnormal semiconductor metrology measurement measured from a fabricated semiconductor component is received. At least one parameter of the fabricated semiconductor component causing the abnormal semiconductor metrology measurement is then automatically determined by one or more hardware processors. In particular, the one or more hardware processors determine a subset of parameters of the fabricated semiconductor component as potential sources of the abnormal semiconductor metrology measurement, rank the parameters in the determined subset of parameters, select an Nth number of the parameters in the determined subset of parameters in accordance with the ranking, and then analyze each of the selected parameters to identify one or more of the selected parameters as the at least one parameter of the fabricated semiconductor component causing the abnormal semiconductor metrology measurement.