公开(公告)号：US12243667B2

公开(公告)日：2025-03-04

申请号：US17759487

申请日：2020-12-25

Applicant: KOA Corporation

Inventor： Yohei Tokiwa ,  Kohji Eto ,  Tomofumi Noguchi ,  Reina Kaneko

IPC: H01C1/14 ,  H01C17/00

Abstract: A manufacturing method of a resistor contains: a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in the stacked direction; a step of passing the resistor base material through a die, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material; and a step of obtaining an individual resistor from the resistor base material passed through the die.

公开(公告)号：US12249448B2

公开(公告)日：2025-03-11

申请号：US17759506

申请日：2020-12-28

Applicant: KOA Corporation

Inventor： Kohji Eto ,  Yohei Tokiwa ,  Reina Kaneko ,  Jumpei Yamamoto

IPC: H01C17/242 ,  H01C1/034 ,  H01C1/144 ,  H01C17/28

Abstract: A resistor is provided with a resistance body and a pair of electrodes connected to the resistance body (a first electrode body, a second electrode body), the resistance body being arranged so as to be at least separated away from a substrate board (a circuit board) when mounted on the substrate board (the circuit board), wherein the resistor has the oxide film on at least one of the resistance body and each of the electrodes (the first electrode body, the second electrode body) at a boundary portion (a bonded portion, a bonded portion) between the resistance body and each of the electrodes (the first electrode body, the second electrode body) on the mounting surface of the resistor.