公开(公告)号：US20180142415A1

公开(公告)日：2018-05-24

申请号：US15577477

申请日：2016-05-27

Applicant: KOLON INDUSTRIES, INC.

Inventor： Bum-Hoon LEE

IPC: D21H13/26 ,  D21H27/30 ,  H01B3/52

CPC classification number: D21H13/26 ,  D21G1/00 ,  D21H27/30 ,  H01B3/52

Abstract: The present disclosure relates to an aramid paper for a honeycomb, which is prepared by mixing, with an aramid floc, an aramid pulp having a fiber length equal to or longer than a predetermined length and a fibril development equal to or higher than a predetermined level, at a predetermined ratio, a wholly aromatic aramid paper for an electrical insulation paper having superior paper formation property and thus having uniform electrical insulation property, which is prepared by mixing an aramid pulp having a fines content equal to or higher than a predetermined ratio at a predetermined ratio, a laminated aramid paper having a uniform thermal expansion coefficient, uniform electrical conductivity and uniform thermal conductivity, which is prepared by laminating an aramid paper with superior paper formation property on an aramid paper with superior paper strength by calendering, and a method for preparing the same. The aramid paper according to the present disclosure is applicable to a material or a component which requires precision with little difference in physical properties such as a thermal expansion coefficient, electrical conductivity and thermal conductivity. Specifically, it is applicable to a honeycomb, an electrical insulation paper, a PCB substrate, etc. because it has superior paper strength and paper formation property. Moreover, the method for preparing an aramid paper can solve the problems of poor transfer of a base paper, nonuniformity of strength and aggregation between flocs.