公开(公告)号：US20130314842A1

公开(公告)日：2013-11-28

申请号：US13677664

申请日：2012-11-15

Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Chong Yun KANG ,  Min Gyu KANG ,  Seok Jin YOON ,  Ji Won CHOI ,  Seung Hyub BAEK ,  Jin Sang KIM

IPC: H01G4/06 ,  H05K5/00

CPC classification number: H01G4/06 ,  H01G4/005 ,  H01G4/085 ,  H01G4/33 ,  H01L28/60 ,  H05K5/0091

Abstract: Provided are a thin film condenser for high-density packaging, a method for manufacturing the same and a high-density package substrate. The thin film condenser for high-density packaging, includes: a support substrate; a lower electrode formed on the support substrate; a dielectric thin film formed on the lower electrode; and an upper electrode formed on the dielectric thin film. Provided also is a method for manufacturing the same. The high-density package substrate, includes: at least two stacked substrates; thin film condensers embedded in the stacked substrates; an internal connection electrode formed in the stacked substrates and connecting the thin film condensers in series or in parallel; a surface electrode formed on the surface of the outermost substrate among the stacked substrates and connected to the internal connection electrode; and an integrated circuit connected to the surface electrode via a bump.

Abstract translation: 提供一种用于高密度封装的薄膜电容器，其制造方法和高密度封装衬底。 用于高密度封装的薄膜冷凝器包括：支撑基板; 形成在所述支撑基板上的下电极; 形成在下电极上的电介质薄膜; 以及形成在电介质薄膜上的上电极。 还提供其制造方法。 高密度封装基板包括：至少两个堆叠的基板; 嵌入在堆叠的基板中的薄膜电容器; 内部连接电极，形成在堆叠的基板中并串联或并联连接薄膜电容器; 表面电极，形成在所述层叠基板的最外侧基板的表面上，与所述内部连接用电极连接; 以及通过凸块与表面电极连接的集成电路。