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公开(公告)号:US20240290732A1
公开(公告)日:2024-08-29
申请号:US18322996
申请日:2023-05-24
Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
IPC: H01L23/00 , G06K19/073
CPC classification number: H01L23/573 , G06K19/07327
Abstract: Provided is a security code including a substrate, metamaterials on the substrate, a signal modulation pattern on the metamaterials, and a capping layer covering the signal modulation pattern and the metamaterials, wherein the metamaterials include a pair of metal patterns facing each other, the signal modulation pattern covers a portion of the metal patterns, and expose remaining of the metal patterns, and the signal modulation pattern has a different material from each of the metal patterns.