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公开(公告)号:US20230066491A1
公开(公告)日:2023-03-02
申请号:US17893016
申请日:2022-08-22
申请人: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY , RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
发明人: In Soo KIM , Donghee Son , Hannah Kwon , Hye Jun Kim , Duhwan Seong , Jinhyun Kim
IPC分类号: H01L25/16
摘要: Provided is a device assembly including a substrate for mounting a device thereon, electrodes provided on the substrate to be electrically connected to the device, and an encapsulation provided on the substrate and the electrodes to accommodate and encapsulate the device therein, wherein the substrate and the encapsulation are made of a self-healing polymer (SHP), and wherein the electrodes are made of a conductive polymer composite including the SHP.