Component handling device
    1.
    发明申请
    Component handling device 审中-公开
    组件处理设备

    公开(公告)号:US20070090150A1

    公开(公告)日:2007-04-26

    申请号:US11260016

    申请日:2005-10-26

    IPC分类号: B23K5/00 B23K1/00 B23K5/22

    CPC分类号: B23K37/04

    摘要: A component handling device is disclosed. The component handling device includes a body with a component receiving portion that has a front region defining a first opening and a rear region defining a second opening. Also, the component receiving portion includes a component encasing wall extending from the first opening to the second opening. Additionally, a component elevating feature configured to assist with detaching the component from a substrate is coupled to the interior surface of the component encasing wall. In addition, a user gripping feature is coupled to the body of the component handling device. Moreover, a component bounding feature proximate to the second opening is coupled to the body to prevent the component from moving past the second opening. Furthermore, a component retaining feature is coupled to the interior surface of the component encasing wall for retaining the component when the component is placed within the component handling device.

    摘要翻译: 公开了一种部件处理装置。 部件处理装置包括具有部件接收部分的主体,其具有限定第一开口的前部区域和限定第二开口的后部区域。 此外,部件接收部分包括从第一开口延伸到第二开口的部件封装壁。 另外,构造成辅助将部件从基板分离的部件升高部件联接到部件封装壁的内表面。 此外,用户抓握特征联接到部件处理装置的主体。 此外,靠近第二开口的部件界定特征联接到主体以防止部件移动经过第二开口。 此外,部件保持特征联接到部件封装壁的内表面,用于当部件放置在部件处理装置内时保持部件。

    Apparatus and method for enhancing conductivity
    2.
    发明授权
    Apparatus and method for enhancing conductivity 有权
    增强电导率的装置和方法

    公开(公告)号:US07697305B2

    公开(公告)日:2010-04-13

    申请号:US11741256

    申请日:2007-04-27

    IPC分类号: H05K9/00

    摘要: An apparatus is provided comprising a chassis of a sheet of an electrically conductive material having a substantially non-conductive coating. An exposed portion of the chassis can be deformed to provide at least one protrusion such that the non-conductive coating on the at least one protrusion is thinner than a portion of the sheet spaced apart from the at least one protrusion to provide a conductivity path through the sheet.

    摘要翻译: 提供了一种装置,其包括具有基本不导电涂层的导电材料片的底架。 底架的暴露部分可以变形以提供至少一个突起,使得至少一个突起上的非导电涂层比距离至少一个突起间隔开的片的一部分更薄,以提供穿过 该表。

    APPARATUS AND METHOD FOR ENHANCING CONDUCTIVITY
    3.
    发明申请
    APPARATUS AND METHOD FOR ENHANCING CONDUCTIVITY 有权
    提高电导率的装置和方法

    公开(公告)号:US20080264663A1

    公开(公告)日:2008-10-30

    申请号:US11741256

    申请日:2007-04-27

    IPC分类号: H01B7/29

    摘要: An apparatus is provided comprising a chassis of a sheet of an electrically conductive material having a substantially non-conductive coating. An exposed portion of the chassis can be deformed to provide at least one protrusion such that the non-conductive coating on the at least one protrusion is thinner than a portion of the sheet spaced apart from the at least one protrusion to provide a conductivity path through the sheet.

    摘要翻译: 提供了一种装置,其包括具有基本不导电涂层的导电材料片的底架。 底架的暴露部分可以变形以提供至少一个突起,使得至少一个突起上的非导电涂层比距离至少一个突起间隔开的片的一部分更薄,以提供穿过 该表。