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公开(公告)号：US07156933B2
公开(公告)日：2007-01-02
申请号：US10462422
申请日：2003-06-16
CPC分类号： B24B37/30 , B24B37/005 , B24B41/06 , Y10T156/1089 , Y10T156/1092
摘要： By applying heat and pressure to a backing film with an adhesive layer while mounting it to a polish head used for chemical mechanical polishing, inhomogeneities inside the adhesive layer, e.g. thickness and compressibility variations or air bubbles can easily be removed. A corresponding configuration includes a device for exerting a uniform pressure force, which can be a roller made of silicone or rubber, or a plate. The configuration also includes a device for heating and a control unit for controlling the heat and the pressure force. After the backing film is installed using this configuration and method, the polish head can be used to uniformly remove material from a semiconductor wafer surface and therefore the wafer yield is advantageously increased.
摘要翻译： 通过将热和压力施加到具有粘合剂层的背衬膜上，同时将其安装到用于化学机械抛光的抛光头，粘合剂层内的不均匀性，例如粘合剂层。 可以容易地去除厚度和压缩性变化或气泡。 相应的配置包括用于施加均匀压力的装置，其可以是由硅树脂或橡胶制成的辊或板。 该构造还包括用于加热的装置和用于控制热量和压力的控制单元。 在使用这种配置和方法安装背衬膜之后，可以使用抛光头来均匀地从半导体晶片表面去除材料，因此有利地提高了晶片产量。
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公开(公告)号：US06375549B1
公开(公告)日：2002-04-23
申请号：US09527859
申请日：2000-03-17
IPC分类号： B24B100
CPC分类号： B24B37/30 , B24B49/16 , H01L21/6833 , Y10T279/23
摘要： A polishing head (200) for a chemical-mechanical polishing machine that holds a semiconductor wafer (150) against a polishing pad (140) has a chuck (295) with a pressure chamber (210) to apply a down force substantially equally to the wafer backside (152). An electrode arrangement (270) within the chamber (210) is located coplanar to the wafer (150) to provide compensation to wafer or chuck irregularities by applying a compensation force having a distribution corresponding to the irregularities.
摘要翻译： 用于将半导体晶片（150）保持在抛光垫（140）上的用于化学机械抛光机的抛光头（200）具有带有压力室（210）的卡盘（295），以大致相等地施加向下的力 晶片背面（152）。 腔室（210）内的电极装置（270）与晶片（150）共面定位，以通过施加具有对应于不规则的分布的补偿力来向晶片或卡盘不规则性提供补偿。
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公开(公告)号：US20050075049A1
公开(公告)日：2005-04-07
申请号：US10462422
申请日：2003-06-16
IPC分类号： B24B37/005 , B24B37/30 , B24B41/06 , H01L21/304 , B24B49/00 , B24B1/00
CPC分类号： B24B37/30 , B24B37/005 , B24B41/06 , Y10T156/1089 , Y10T156/1092
摘要： By applying heat and pressure to a backing film with an adhesive layer while mounting it to a polish head used for chemical mechanical polishing, inhomogeneities inside the adhesive layer, e.g. thickness and compressibility variations or air bubbles can easily be removed. A corresponding configuration includes a device for exerting a uniform pressure force, which can be a roller made of silicone or rubber, or a plate. The configuration also includes a device for heating and a control unit for controlling the heat and the pressure force. After the backing film is installed using this configuration and method, the polish head can be used to uniformly remove material from a semiconductor wafer surface and therefore the wafer yield is advantageously increased.
摘要翻译： 通过将热和压力施加到具有粘合剂层的背衬膜上，同时将其安装到用于化学机械抛光的抛光头，粘合剂层内的不均匀性，例如粘合剂层。 可以容易地去除厚度和压缩性变化或气泡。 相应的配置包括用于施加均匀压力的装置，其可以是由硅树脂或橡胶制成的辊或板。 该构造还包括用于加热的装置和用于控制热量和压力的控制单元。 在使用该配置和方法安装背衬膜之后，可以使用抛光头来均匀地从半导体晶片表面去除材料，因此有利地提高晶片产量。
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公开(公告)号：US06824456B2
公开(公告)日：2004-11-30
申请号：US10403880
申请日：2003-03-31
申请人： Katrin Ebner , Walter Glashauser
发明人： Katrin Ebner , Walter Glashauser
IPC分类号： B24B700
摘要： A polish head for Chemical Mechanical Polishing includes a backing film of silicone on a rigid support element, preferably, of amorphous ceramic. The silicone backing film is fabricated by molding, thereby enabling an appropriate cross-sectional shape for specific polishing needs. The head provides a uniform polishing of a semiconductor wafer.
摘要翻译： 用于化学机械抛光的抛光头包括在刚性支撑元件上的硅树脂的背衬膜，优选为无定形陶瓷。 通过模塑制造硅树脂背衬膜，从而能够为特定的抛光需要提供适当的横截面形状。 头部提供半导体晶片的均匀抛光。
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