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公开(公告)号：US08792031B2
公开(公告)日：2014-07-29
申请号：US13033376
申请日：2011-02-23
申请人： Katsuhisa Mochiduki , Takanori Suzuki , Fujio Ito
发明人： Katsuhisa Mochiduki , Takanori Suzuki , Fujio Ito
CPC分类号： H01L27/14618 , H01L2924/0002 , H04N5/335 , H01L2924/00
摘要： A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident.
摘要翻译： 一种固态摄像装置，包括：树脂封装，其包括凹部; 设置在所述凹部中的固态图像拾取元件; 以及通过固定构件固定到所述凹部的盖，以覆盖所述固态图像拾取元件，其中：所述树脂封装包括与其一体化的基板; 所述基板包括第一突出部分，第二突出部分和分支部分，所述第一和第二突出部分从所述树脂封装的第一侧突出，并且所述分支部分设置在所述树脂封装内部并且设置在所述第一和第二突出部分之间 突出部分 并且当从光入射的方向观察时，所述固定构件的外周部设置在所述分支部的端部的内侧。
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公开(公告)号：US20110205414A1
公开(公告)日：2011-08-25
申请号：US13033376
申请日：2011-02-23
申请人： Katsuhisa Mochiduki , Takanori Suzuki , Fujio Ito
发明人： Katsuhisa Mochiduki , Takanori Suzuki , Fujio Ito
IPC分类号： H04N5/335 , H01L31/0203
CPC分类号： H01L27/14618 , H01L2924/0002 , H04N5/335 , H01L2924/00
摘要： A solid-state image pickup device including: a resin package which includes a recessed section; a solid-state image pickup element disposed in the recessed section; and a cover fixed to the recessed section via a fixing member so as to cover the solid-state image pickup element, wherein: the resin package includes a substrate integrated therewith; the substrate includes a first protruding section, a second protruding section and a branched section, the first and second protruding sections protruding from a first side of the resin package, and the branched section being disposed inside the resin package and disposed between the first and second protruding sections; and an outer peripheral section of the fixing member is disposed inside an end of the branched section when seen from the direction in which light is incident.
摘要翻译： 一种固态摄像装置，包括：树脂封装，其包括凹部; 设置在所述凹部中的固态图像拾取元件; 以及通过固定构件固定到所述凹部的盖，以覆盖所述固态图像拾取元件，其中：所述树脂封装包括与其一体化的基板; 所述基板包括第一突出部分，第二突出部分和分支部分，所述第一和第二突出部分从所述树脂封装的第一侧突出，并且所述分支部分设置在所述树脂封装内部并且设置在所述第一和第二突出部分之间 突出部分 并且当从光入射的方向观察时，所述固定构件的外周部设置在所述分支部的端部的内侧。
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3.发明授权公开(公告)号：US08643773B2
公开(公告)日：2014-02-04
申请号：US12503888
申请日：2009-07-16
申请人： Katsuhisa Mochiduki
发明人： Katsuhisa Mochiduki
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2924/0002 , H04N5/2253 , H04N5/2254 , Y10T156/10 , H01L2924/00
摘要： A manufacturing method of a solid-state imaging apparatus includes the steps of: preparing a solid-state imaging device having a light receiving region at a main surface thereof; preparing a light transmitting member having an extending portion extending from the solid-state imaging device; preparing a holding member having a space for holding the solid-state imaging device therein, and having a positioning portion for positioning the solid-state imaging device; fixing the light transmitting member to the main surface of the solid-state imaging device in parallel to each other to keep a constant interval therebetween; bringing a side of the solid-state imaging device to meet the positioning portion of the holding member; and fixing the extending portion of the light transmitting member to the holding member.
摘要翻译： 固态成像装置的制造方法包括以下步骤：准备在其主表面具有受光区域的固态成像装置; 制备具有从固态成像装置延伸的延伸部分的透光构件; 准备具有用于保持固态成像装置的空间的保持构件，并具有用于定位固态成像装置的定位部分; 将透光构件彼此平行地固定到固态成像装置的主表面，以在它们之间保持恒定的间隔; 使固态成像装置的一侧与保持构件的定位部相遇; 并且将所述透光构件的延伸部分固定到所述保持构件。
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4.发明申请公开(公告)号：US20100045832A1
公开(公告)日：2010-02-25
申请号：US12503888
申请日：2009-07-16
申请人： Katsuhisa Mochiduki
发明人： Katsuhisa Mochiduki
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2924/0002 , H04N5/2253 , H04N5/2254 , Y10T156/10 , H01L2924/00
摘要： A manufacturing method of a solid-state imaging apparatus includes the steps of: preparing a solid-state imaging device having a light receiving region at a main surface thereof; preparing a light transmitting member having an extending portion extending from the solid-state imaging device; preparing a holding member having a space for holding the solid-state imaging device therein, and having a positioning portion for positioning the solid-state imaging device; fixing the light transmitting member to the main surface of the solid-state imaging device in parallel to each other to keep a constant interval therebetween; bringing a side of the solid-state imaging device to meet the positioning portion of the holding member; and fixing the extending portion of the light transmitting member to the holding member.
摘要翻译： 固态成像装置的制造方法包括以下步骤：准备在其主表面具有受光区域的固态成像装置; 制备具有从固态成像装置延伸的延伸部分的透光构件; 准备具有用于保持固态成像装置的空间的保持构件，并具有用于定位固态成像装置的定位部分; 将透光构件彼此平行地固定到固态成像装置的主表面，以在它们之间保持恒定的间隔; 使固态成像装置的一侧与保持构件的定位部相遇; 并且将所述透光构件的延伸部分固定到所述保持构件。
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