Reliability analysis of integrated circuits
    1.
    发明授权
    Reliability analysis of integrated circuits 失效
    集成电路的可靠性分析

    公开(公告)号:US07480874B2

    公开(公告)日:2009-01-20

    申请号:US11198930

    申请日:2005-08-05

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5036

    摘要: Techniques are presented for reliability analysis of integrated circuits. A circuit data file including a connectivity network with appended parasitic information is obtained. Circuit performance is simulated, based on the data file, to obtain simulated currents for metallic conductive paths of the circuit. Contextual representations of the paths are determined, and reliability analysis is performed on the contextual representations. The analysis can relate, for example, to electromigration, joule-heating, and/or fusing. The results of the analysis can be provided, for example, in the form of a report including recommended changes, such as width increases, to wires for which it is determined that reliability issues exist.

    摘要翻译: 介绍了集成电路可靠性分析的技术。 获得包括具有附加寄生信息的连通性网络的电路数据文件。 基于数据文件模拟电路性能,以获得电路的金属导电路径的模拟电流。 确定路径的上下文表示,并对上下文表示进行可靠性分析。 该分析可以涉及例如电迁移,焦耳加热和/或熔化。 分析结果可以例如以报告的形式提供,包括推荐的变化(例如宽度增加)到确定可靠性问题的电线。

    Reliability analysis of integrated circuits
    2.
    发明申请
    Reliability analysis of integrated circuits 失效
    集成电路的可靠性分析

    公开(公告)号:US20070033555A1

    公开(公告)日:2007-02-08

    申请号:US11198930

    申请日:2005-08-05

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5036

    摘要: Techniques are presented for reliability analysis of integrated circuits. A circuit data file including a connectivity network with appended parasitic information is obtained. Circuit performance is simulated, based on the data file, to obtain simulated currents for metallic conductive paths of the circuit. Contextual representations of the paths are determined, and reliability analysis is performed on the contextual representations. The analysis can relate, for example, to electromigration, joule-heating, and/or fusing. The results of the analysis can be provided, for example, in the form of a report including recommended changes, such as width increases, to wires for which it is determined that reliability issues exist.

    摘要翻译: 介绍了集成电路可靠性分析的技术。 获得包括具有附加寄生信息的连通性网络的电路数据文件。 基于数据文件模拟电路性能,以获得电路的金属导电路径的模拟电流。 确定路径的上下文表示,并对上下文表示进行可靠性分析。 该分析可以涉及例如电迁移,焦耳加热和/或熔化。 分析结果可以例如以报告的形式提供,包括推荐的变化(例如宽度增加)到确定可靠性问题的电线。