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公开(公告)号:US20080110600A1
公开(公告)日:2008-05-15
申请号:US11946561
申请日:2007-11-28
IPC分类号: F28D15/00
CPC分类号: H01L23/473 , G06F1/20 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要: The present invention provides a cooling apparatus which is easy to build and to fix it to electronic devices, superior in thermal conduction and heat dissipation, and possible to make thin the total configuration of the apparatus. The liquid cooling unit 9 and the air cooling unit 12 are formed in a unit. A heat absorption surface 19 of the liquid cooling unit 9 is contacted or bonded to the heat generation component such as the CPU and the heat generator, which have the largest power consumption and also locally generate heat within a small area in the box 2. In the liquid cooling unit 9, a liquid cooling pump 14 composed of an electromagnetic pump is arranged for circulating the coolant in the flow path 10. The heat generated by the heat generation components such as CPU 6, heat generator 7, and the like is thermally diffused with heat conduction into the whole liquid cooling unit 9 by circulating the coolant with the liquid cooling pump 14.
摘要翻译: 本发明提供了一种易于构建并将其固定在电子设备上的散热装置,其热传导和散热优良,并且可以使装置的总体构型变薄。 液体冷却单元9和空气冷却单元12形成为一个单元。 液体冷却单元9的吸热表面19接触或结合到具有最大功率消耗的CPU和热发生器等发热组件,并且还在箱体2的小区域内局部地产生热量。 在液体冷却单元9中,布置有由电磁泵构成的液体冷却泵14,用于使冷却剂在流路10中循环。 由CPU 6,发热体7等发热部件产生的热量,通过使冷却液与液体冷却泵14循环,热传导到整个液体冷却单元9。