公开(公告)号：US20120208012A1

公开(公告)日：2012-08-16

申请号：US13388879

申请日：2010-07-20

申请人： Keisuke Watanabe ,  Masakazu Morimoto ,  Junki Mori ,  Masayoshi Natsume

发明人： Keisuke Watanabe ,  Masakazu Morimoto ,  Junki Mori ,  Masayoshi Natsume

IPC分类号： B32B27/18 ,  B24B7/16 ,  C09J7/02

CPC分类号： H01L21/6836 ,  C08K5/0041 ,  C08K5/0091 ,  C09J7/20 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2205/106 ,  H01L2221/68327 ,  Y10T428/2848 ,  Y10T428/31504

摘要： A semiconductor processing sheet contains a base layer having a plastic sheet containing pigment as a core layer, wherein a non-pigment-containing layer is arranged in the outermost layer on front and back main surfaces of the core layer. According to the present invention, in a process for manufacturing semiconductor devices, it is possible to minimize contamination of the inner surface for the film manufacturing die that is due to the pigment contained in the film while maintaining the visibility of the semiconductor processing sheet. Consequently, partial occlusion of the die lip aperture due to pigment contamination is reduced, with the result that effective prevention of the deterioration of the sheet thickness precision due to adhering pigment is possible.

摘要翻译： 半导体处理片包含具有含有颜料作为核心层的塑料片的基底层，其中，在芯层的前后主表面的最外层配置有非颜料含量层。 根据本发明，在半导体装置的制造方法中，能够使保持半导体处理用片材的可视性的同时，使包含在膜中的颜料导致的膜制造用模具的内表面的污染最小化。 因此，由于颜料污染导致的模唇孔的局部闭塞减少，结果是可以有效地防止由于颜料附着引起的板厚精度的劣化。