公开(公告)号：US09847175B2

公开(公告)日：2017-12-19

申请号：US14152389

申请日：2014-01-10

Applicant: Kemet Electronics Corporation

Inventor： Maurice Perea ,  R Allen Hill ,  Reggie Phillips

IPC: H01G7/00 ,  H01G4/30 ,  H01C1/14 ,  H01G4/232 ,  H01C1/014

CPC classification number: H01G4/30 ,  H01C1/014 ,  H01C1/14 ,  H01G4/232 ,  Y10T29/417 ,  Y10T29/43

Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.

公开(公告)号：US10068708B2

公开(公告)日：2018-09-04

申请号：US15007355

申请日：2016-01-27

Applicant: Kemet Electronics Corporation

Inventor： Maurice Perea ,  R Allen Hill ,  Reggie Phillips

IPC: H01G7/00 ,  H01G4/30 ,  H01C1/14 ,  H01G4/232 ,  H01C1/014

Abstract: A method of forming a stacked electronic component, and an electronic component formed by the method wherein the method includes: providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination; providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads; providing a molded case comprising a cavity and a bottom; and forming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate with the barbs protruding towards the electronic components and the leads extending through the bottom.

公开(公告)号：US20160141106A1

公开(公告)日：2016-05-19

申请号：US15007355

申请日：2016-01-27

Applicant: Kemet Electronics Corporation

Inventor： Maurice Perea ,  R Allen Hill ,  Reggie Phillips

IPC: H01G4/30

CPC classification number: H01G4/30 ,  H01C1/014 ,  H01C1/14 ,  H01G4/232 ,  Y10T29/417 ,  Y10T29/43

Abstract: A method of forcing a stacked electronic component, and an electronic component formed by the method, therein the method includes:providing a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination;providing a first lead frame plate and a second lead frame plate wherein the first lead frame plate and the second lead frame plate comprises barbs and leads;providing a molded case comprising a cavity and a bottom; and terming a sandwich of electronic components in an array between the first lead frame plate and the second lead frame plate which the barbs protruding towards the electronic components and the leads extending through the bottom.

Abstract translation: 一种强制堆叠电子元件的方法，以及通过该方法形成的电子部件，其中所述方法包括：提供多个电子部件，其中每个电子部件包括第一外部端接和第二外部端接; 提供第一引线框架板和第二引线框架板，其中第一引线框架板和第二引线框架板包括倒钩和引线; 提供包括空腔和底部的模制外壳; 并且将第一引线框架板和第二引线框架板之间的阵列中的电子部件的三明治命名为倒钩朝向电子部件突出的引线，并且引线延伸穿过底部。