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公开(公告)号：US20100187680A1
公开(公告)日：2010-07-29
申请号：US12654440
申请日：2009-12-18
申请人： Kenji Otsuka , Masaru Nakashima
发明人： Kenji Otsuka , Masaru Nakashima
IPC分类号： H01L23/367
CPC分类号： H01L23/3735 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A radiator includes: an insulating substrate, a heating element or a semiconductor chip is mounted; and a heat sink that is provided the insulating substrate through a stress relaxation member that has a stress absorbing space, in which the heat sink dissipates heat from the semiconductor chip. The insulating substrate, the stress relaxation member, and the heat sink are braze-bonded to each other. The heat sink has: a top plate that is bonded to the stress relaxation member; and a bottom plate that is bonded to the top plate, and the top plate and the bottom plate forms a passage of coolant therebetween. A thickness proportion between the top plate and the bottom plate falls within a range of 1:3 to 1:5.
摘要翻译： 散热器包括：绝缘基板，加热元件或半导体芯片; 以及通过具有应力消除空间的应力松弛部件设置绝缘基板的散热器，其中散热器散发来自半导体芯片的热量。 绝缘基板，应力松弛部件和散热器彼此钎焊。 散热器具有：结合到应力松弛部件的顶板; 以及底板，其结合到顶板，并且顶板和底板在其间形成冷却剂通道。 顶板和底板之间的厚度比例在1:3至1:5的范围内。
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公开(公告)号：US20100180441A1
公开(公告)日：2010-07-22
申请号：US12591929
申请日：2009-12-04
申请人： Kenji Otsuka , Masaru Nakashima , Yoshiki Tomita
发明人： Kenji Otsuka , Masaru Nakashima , Yoshiki Tomita
IPC分类号： B23P15/26
CPC分类号： B23K1/0012 , Y10T29/49393
摘要： A method of brazing a heat sink includes: fitting at least a part of a bottom plate between protruding opposite ends of a top plate; fixing a jig to an outer periphery of the top plate in order to prevent the top plate that thermally expands from extending outward in a width direction of the top plate; and braze-bonding an inner side surface of the top plate to a side surface of the bottom plate, which faces the inner side surface of the top plate.
摘要翻译： 钎焊散热器的方法包括：将顶板的突出的相对端部的底板的至少一部分嵌合; 将夹具固定到顶板的外周，以防止热膨胀的顶板在顶板的宽度方向上向外延伸; 并且将顶板的内侧表面钎焊到底板的与顶板的内侧表面相对的侧表面。
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公开(公告)号：US4136030A
公开(公告)日：1979-01-23
申请号：US879108
申请日：1978-02-17
CPC分类号： E02B15/046 , Y10S210/923
摘要： Improvements are made in the known apparatus for collecting effluent oil of the type such that the apparatus includes a pair of left and right side plates disposed at a predetermined distance in a forwardly opened arrangement, a weir plate mounted to said side plates as inclined in a rear-downward direction so that its opposite side edges may contact with the inner wall surfaces of said respective side plates under a water surface, a slant plate disposed with its rear end positioned above the rear end of said weir plate at the rear ends of said side plates and having its opposite side edges fixedly secured to the inner wall surfaces of said side plates, an oil leakage preventing plate positioned in the midway between the rear end of said weir plate and the rear end of said slant plate and having its opposite side edges fixedly secured to the inner wall surfaces of said side plates to form a water discharge port between said oil leakage preventing plate and the rear end of said weir plate and to form an oily water intake port between said oil leakage preventing plate and the rear end of said slant plate, an oily water intake pipe communicated with said oily water intake port, a pair of left and right wave buffer chambers which are of substantially cylindrical shape having their top and bottom ends closed and having their side walls partly cut away, and float means mounted to said side plates. The improvements exist in that said slant plate is appropriately inclined in an obliquely rear-upward direction with its rear end extended into said wave buffer chambers, and that between said wave buffer chambers and an oil pool formed as delimited by said side plates, weir plate and oil leakage preventing plate is provided a water conduit path for communicating therebetween.
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