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    Electronic housing assembly and method
    1.
    发明授权
    Electronic housing assembly and method 失效
    电子外壳组装及方法

    公开(公告)号：US07085140B2

    公开(公告)日：2006-08-01

    申请号：US10679548

    申请日：2003-10-06

    申请人： Kevin D. Page ,  Douglas W. Moskowitz

    发明人： Kevin D. Page ,  Douglas W. Moskowitz

    IPC分类号： H05K7/18

    CPC分类号： H04M1/0249 ,  H04M1/72519

    摘要： A housing assembly (100) and method (300) of assembly includes a housing (105) having one or more recessed areas (130) on at least a first side (120). Also included is a floor member (110) having one or more protrusions (135) and is pivotably mounted to one or more recessed areas on the first side using the protrusions. A tubular member (115) is included for engaging the floor member on a second side (125) of the housing where the engagement prevents the floor member from pivoting. The method of assembly includes engaging and pivotably mounting (310) a first portion of a floor member to a first side of a housing and pivoting (315) the floor member to an assembled position. The method further includes engaging (320) a second portion of the floor member by slidably introducing a tubular member through the housing and adjacent to a blocking structure of the floor member, thereby substantially preventing further pivoting of the floor member.

    摘要翻译： 壳体组件（100）和组件的方法（300）包括在至少第一侧（120）上具有一个或多个凹陷区域（130）的壳体（105）。 还包括具有一个或多个突起（135）的地板构件（110），并且使用突起可枢转地安装到第一侧上的一个或多个凹陷区域。 包括管状构件（115），用于在壳体的第二侧（125）处接合地板构件，其中接合防止地板构件枢转。 组装方法包括将地板构件的第一部分接合并可枢转地安装（310）到壳体的第一侧并将地板构件（315）转动（315）到组装位置。 该方法还包括通过可滑动地引导管状构件穿过壳体并邻近地板构件的阻挡结构来接合（320）地板构件的第二部分，从而基本上防止地板构件进一步枢转。