DISPLAY DEVICE, MANUFACTURING METHOD OF THE DISPLAY DEVICE, ORGANIC LIGHT EMITTING DIODE DISPLAY
    2.
    发明申请
    DISPLAY DEVICE, MANUFACTURING METHOD OF THE DISPLAY DEVICE, ORGANIC LIGHT EMITTING DIODE DISPLAY 有权
    显示装置,显示装置的制造方法,有机发光二极管显示

    公开(公告)号:US20120104937A1

    公开(公告)日:2012-05-03

    申请号:US13077100

    申请日:2011-03-31

    IPC分类号: H01J1/62 H01J5/00 H01J9/26

    CPC分类号: H01L51/524

    摘要: A method of manufacturing a display device includes: forming a display unit on a substrate; disposing a bonding layer including thermosetting resin and surrounding the display unit, on the substrate; forming a sealing substrate including a composite member and a metal layer disposed on one side of the composite member, the composite member including a resin matrix and a plurality of carbon fibers; disposing the sealing substrate on the bonding layer such that the metal layer faces the display unit; and bonding the substrate with the sealing substrate by hardening the bonding layer, connecting a power source to the plurality of carbon fibers to use the composite member as a heating body.

    摘要翻译: 一种制造显示装置的方法包括:在基板上形成显示单元; 在基板上设置包括热固性树脂并围绕显示单元的粘合层; 形成包括复合构件和设置在所述复合构件的一侧上的金属层的密封基板,所述复合构件包括树脂基体和多个碳纤维; 将所述密封基板设置在所述接合层上,使得所述金属层面向所述显示单元; 以及通过硬化所述接合层将所述基板与所述密封基板接合,将电源连接到所述多个碳纤维,以使用所述复合构件作为加热体。

    Display Apparatus
    3.
    发明申请
    Display Apparatus 有权
    显示装置

    公开(公告)号:US20110289809A1

    公开(公告)日:2011-12-01

    申请号:US13004527

    申请日:2011-01-11

    IPC分类号: A47G1/06

    摘要: A display apparatus including: a display unit disposed on a substrate; an encapsulation unit facing the display unit, the encapsulation unit including: a metal layer; a complex member; and a reinforcement member formed on an upper surface of the complex member; and a sealing unit disposed between the substrate and the encapsulation unit and apart from the display unit to bond the substrate and the encapsulation unit to the sealing unit.

    摘要翻译: 一种显示装置,包括:显示单元,设置在基板上; 面向所述显示单元的封装单元,所述封装单元包括:金属层; 一个复杂的成员; 以及形成在复合构件的上表面上的加强构件; 以及密封单元,其设置在所述基板和所述封装单元之间并且与所述显示单元分离以将所述基板和所述封装单元接合到所述密封单元。