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公开(公告)号:US6054554A
公开(公告)日:2000-04-25
申请号:US306757
申请日:1999-05-07
申请人: Kil Yeong Choi , Mi Hie Yi , Wenxi Huang
发明人: Kil Yeong Choi , Mi Hie Yi , Wenxi Huang
CPC分类号: C08G73/10
摘要: The invention herein relates to a novel soluble polyimide resin comprising polyalicyclic structures and the process of preparation of the same, wherein aromatic tetracarboxylic dianhydride and novel aromatic diamine having an polyalicyclic group with various structures are used to yield a novel form of a polyimide resin, which has superior heat-resistance, solubility, and transparency.More specifically, the invention herein relates to a novel polyimide resin having excellent heat-resistance and solubility, which is prepared by means of reacting diamine monomers having a novel chemical structure with various types of aromatic carboxilic dianhydrides, in stead of aromatic diamine used for the preparation of the conventional polyimide resin. As a result, the polymers so obtained had the glass transition temperature of 260.degree. C..about.410.degree. C. and showed a increase in solubility in proportion to the increase in a number of the aromatic rings between two phenyl groups. Further, the polymers herein showed superior solubility at room temperature in various types of organic solvents, e.g., m-cresol, N-methylpyrrolidone or dimethylacetamide.
摘要翻译: 本发明涉及一种包含多环脂结构的新型可溶性聚酰亚胺树脂及其制备方法,其中使用具有各种结构的芳族四羧酸二酐和具有多环脂基的新型芳族二胺以产生新型的聚酰亚胺树脂,其中 具有优异的耐热性,溶解性和透明性。 更具体地说,本发明涉及具有优异的耐热性和溶解性的新型聚酰亚胺树脂,其通过使具有新型化学结构的二胺单体与各种类型的芳族羧酸二酐反应而制备,代替芳族二胺用于 常规聚酰亚胺树脂的制备。 结果,如此获得的聚合物的玻璃化转变温度为260℃,差异410℃,并且与两个苯基之间的芳环数量的增加成比例地显示出溶解度增加。 此外,本文的聚合物在各种类型的有机溶剂例如间甲酚,N-甲基吡咯烷酮或二甲基乙酰胺中在室温下表现出优异的溶解度。
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公开(公告)号:US06172127B2
公开(公告)日:2001-01-09
申请号:US09151735
申请日:1998-09-11
申请人: Kil Yeong Choi , Jae Heung Lee , Sung Goo Lee , Mi Hie Yi , Seung Su Kim
发明人: Kil Yeong Choi , Jae Heung Lee , Sung Goo Lee , Mi Hie Yi , Seung Su Kim
IPC分类号: C08J902
CPC分类号: C08J9/02 , C08G73/1021 , C08G73/1028 , C08J9/28 , C08J2379/08
摘要: The invention herein relates to a process of preparing a novel polyimide foam having superior heat-resistance, flame retardancy, homogeneous size and distribution of cells, and low density, wherein a polyimide precursor in a granular form is prepared by means of using heterocyclic amine as catalyst and then foaming. According to the present invention, the preparing process of a polyimide foam comprises reacting aromatic carboxylic acid or the anhydrides thereof with an excess of aliphatic univalent alcohol to yield an aromatic ester solution. To the aromatic ester solution, divalent amines or the mixture thereof were added in the equivalent amount of said carboxylic acid or the anhydrides thereof in addition to a catalyst and surfactant to yield a polyimide. Then, the precursor in a granular form mixture was imidized while foaming by means of pre-heating and then heating in a microwave oven, after which was cured at a high temperature. Consequently, the present invention has the effect of providing a preparing process for a polyimide foam with superior heat-resistance and heat-insulating property, which can be widely used as substrate in aerospace, submarine, special ship, and high-speed train.
摘要翻译: 本发明涉及一种制备具有优异的耐热性,阻燃性,均匀尺寸和细胞分布以及低密度的新型聚酰亚胺泡沫的方法,其中通过使用杂环胺作为颗粒形式制备颗粒形式的聚酰亚胺前体 催化剂,然后发泡。根据本发明,聚酰亚胺泡沫的制备方法包括使芳族羧酸或其酸酐与过量的脂肪族单价醇反应,得到芳族酯溶液。 除了催化剂和表面活性剂之外,向芳族酯溶液中加入等量的所述羧酸或其酸酐的二价胺或其混合物以产生聚酰亚胺。 然后,将颗粒状混合物中的前体通过预热加热发泡,然后在微波炉中加热,然后在高温下固化。因此,本发明具有提供制备方法 具有优异的耐热性和隔热性的聚酰亚胺泡沫,可广泛用作航空航天,潜艇,专用船和高速列车的基板。
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公开(公告)号:US5243010A
公开(公告)日:1993-09-07
申请号:US852075
申请日:1992-03-13
申请人: Kil-Yeong Choi , Mi Hie Yi
发明人: Kil-Yeong Choi , Mi Hie Yi
摘要: This invention relates to the aromatic polyamide resin of the following general formula(I) having pendant silyl groups characterized in that the said polyamide resin has excellent solubility for the films to be easily prepared by solvent casting as well as useful as coating materials, can be used at higher temperature than the reported polyamides because of the excellent heat stability, and also has excellent adhesive strength in the blend with glass fiber. ##STR1##
摘要翻译: 本发明涉及具有侧壁甲硅烷基的以下通式(I)的芳族聚酰胺树脂,其特征在于所述聚酰胺树脂对通过溶剂浇铸容易制备的膜具有优异的溶解性,并且可用作涂料,可以是 由于具有优异的热稳定性,因此在比报道的聚酰胺更高的温度下使用,并且在与玻璃纤维的共混物中也具有优异的粘合强度。 (一)
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