公开(公告)号：US20130000852A1

公开(公告)日：2013-01-03

申请号：US13613384

申请日：2012-09-13

申请人： Kimihiro NAKADA ,  Yasumasa IWATA ,  Akihiko NAKAMURA ,  Yoshihiro INAO ,  Satoshi KOBARI

发明人： Kimihiro NAKADA ,  Yasumasa IWATA ,  Akihiko NAKAMURA ,  Yoshihiro INAO ,  Satoshi KOBARI

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  B32B2457/14 ,  H01L21/67132 ,  H01L21/6715 ,  Y10T156/1111 ,  Y10T156/1121 ,  Y10T156/19 ,  Y10T156/1922

摘要： A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.

摘要翻译： 一种用于从包括基底和支撑板的层压板剥离支撑板的剥离方法，所述支撑板通过粘合剂层粘合到晶片上，其中粘合剂层由可溶于非极性溶剂或高极性溶剂的粘合剂形成 ; 并且剥离方法包括供给非极性溶剂或高极性溶剂，使得非极性溶剂或高极性溶剂至少保留在面向支撑板的层压体的该表面的边缘部分上，以及 在层压板的侧表面上。