摘要:
The present invention pertains to a method of preparing a component layer for organic light emitting diodes involving milling a composition comprising: at least one component material selected from the group consisting of hole transporting materials, electron transporting materials, hole injection materials, electron injection materials, and emitting materials; a solvent; and a binder. It has been found that, when milling is used for the preparation of a dispersion or suspension, the surface quality of the resultant component layer can be improved, thereby significantly improving the performance of the organic light emitting device. The present invention also provides organic light emitting devices including the component layer prepared by the above preparation method.