公开(公告)号：US20120128196A1

公开(公告)日：2012-05-24

申请号：US13299525

申请日：2011-11-18

Applicant: Kiyoshi WATANABE ,  Maki MAEDA

Inventor： Kiyoshi WATANABE ,  Maki MAEDA

IPC: H04R1/02

CPC classification number: H04R1/2896 ,  H04R2499/15

Abstract: In an electronic device, a speaker attaching section 17 which is vertically open with respect to a circuit board 10 and into which a speaker 16 is press-fitted is integrally formed on a contact sheet 13 arranged on the circuit board 10 provided inside an upper case 8. Therefore, the speaker 16 can be easily attached in a manner that sound therefrom does not leak, simply by the speaker 16 being press-fitted into the speaker attaching section 17 of the contact sheet 13. Accordingly, in the present invention, the structure of the speaker section 6 is simple and the number of its components is small, whereby the thickness of the speaker section 6 can be reduced. In addition, sound generated by the speaker can be favorably and reliably emitted from the speaker attaching section 17 to the outside of the upper case 8, without chattering noise being generated.

Abstract translation: 在电子设备中，相对于电路板10垂直打开且扬声器16被压配的扬声器安装部17一体形成在布置在设置在上壳体内的电路板10上的接触片13上 因此，简单地将扬声器16压配合到接触片13的扬声器安装部17中，扬声器16可以容易地以其声音不泄漏的方式安装。因此，在本发明中， 扬声器部分6的结构简单，并且其部件的数量小，从而可以减小扬声器部分6的厚度。 此外，扬声器产生的声音可以从扬声器安装部分17被有利地可靠地发射到上壳体8的外部，而不产生振动噪声。