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公开(公告)号:US20230271804A1
公开(公告)日:2023-08-31
申请号:US18174061
申请日:2023-02-24
申请人: Kohta ABE , Kei SASAKI , Kazuki SETO , Kazuki MISHINA , Naoki KOBAYASHI
发明人: Kohta ABE , Kei SASAKI , Kazuki SETO , Kazuki MISHINA , Naoki KOBAYASHI
CPC分类号: B65H43/00 , B31F5/02 , B65H37/04 , B65H2301/5142 , B65H2511/13 , B65H2511/30 , B65H2511/52
摘要: A medium processing apparatus includes a liquid applier, a crimper, a stapler, and circuitry. The liquid applier applies liquid to a liquid application position of a medium. The crimper presses and deforms at least a part to which the liquid is applied by the liquid applier, to bind a plurality of media including the medium to which the liquid is applied. The stapler performs stapling with a staple on a medium bundle in which the plurality of media is bound by the crimper. The circuitry controls operations of the crimper, the liquid applier, and the stapler, and selectively switches between first binding performed by the liquid applier and the crimper and second binding performed by only the stapler, in accordance with information on the medium or a binding position at which the medium bundle is bound by the crimper.
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公开(公告)号:US20230416040A1
公开(公告)日:2023-12-28
申请号:US18331574
申请日:2023-06-08
申请人: Kei SASAKI , Kazuki SETO , Kohta ABE
发明人: Kei SASAKI , Kazuki SETO , Kohta ABE
CPC分类号: B65H37/04 , G03G15/6544 , B65H2301/5142
摘要: A medium processing apparatus includes a liquid applier, a post-processing device, and circuitry. The liquid applier includes a liquid application member that applies liquid to a part of a medium, the medium being at least one medium. The post-processing device binds a bundle of media including the medium to which the liquid is applied by the liquid applier. The circuitry changes, according to a binding condition for the post-processing device, at least one of an amount of movement of the liquid application member toward the medium or a contact time during which the liquid application member is in contact with the medium.
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公开(公告)号:US20240316953A1
公开(公告)日:2024-09-26
申请号:US18605128
申请日:2024-03-14
申请人: Takashi YAMAMOTO , Keisuke SUGIYAMA , Kei SASAKI , Kazuki SETO , Shohei SAITO , Sachika TAMAKI , Kohta ABE
发明人: Takashi YAMAMOTO , Keisuke SUGIYAMA , Kei SASAKI , Kazuki SETO , Shohei SAITO , Sachika TAMAKI , Kohta ABE
CPC分类号: B41J11/0015 , B41J25/001 , G03G15/0867 , G03G15/0887 , G03G15/6544 , G03G2215/0487
摘要: A medium processing apparatus includes a liquid applier, a post-processing device, a liquid storage unit, a mover, and a liquid supplier. The liquid applier applies liquid to at least one medium. The post-processing device performs a given process on a bundle of media including the at least one medium on which the liquid is applied by the liquid applier. The liquid storage unit stores the liquid to be supplied to the liquid applier. The mover causes the liquid applier to move in a reciprocating direction orthogonal to the conveyance direction. The liquid supplier supplies the liquid from the liquid storage unit to the liquid applier and includes an extensible member having an elastic cylindrical part on at least a part of the liquid supplier. The extensible member extends in the reciprocating direction of the mover.
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公开(公告)号:US20240300772A1
公开(公告)日:2024-09-12
申请号:US18584866
申请日:2024-02-22
申请人: Kohta ABE , Kei SASAKI , Keisuke SUGIYAMA , Kazuki SETO , Shohei SAITO , Sachika TAMAKI , Takashi YAMAMOTO
发明人: Kohta ABE , Kei SASAKI , Keisuke SUGIYAMA , Kazuki SETO , Shohei SAITO , Sachika TAMAKI , Takashi YAMAMOTO
IPC分类号: B65H37/04
CPC分类号: B65H37/04 , B65H2301/5126 , B65H2301/5162 , B65H2406/21 , B65H2801/06 , B65H2801/24
摘要: A medium processing apparatus includes a liquid applier and a post-processing device. The liquid applier includes a liquid application member including a foam containable a liquid to apply the liquid to a liquid application region in a part of at least one medium of a bundle of media. The post-processing device performs a given process on a post-processing region in the part of at least one medium having the liquid application region on which the liquid is applied by the liquid applier. The liquid applier applies the liquid to the liquid application region overlapped with at least a part of the post-processing region.
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