公开(公告)号：US20090068929A1

公开(公告)日：2009-03-12

申请号：US12282597

申请日：2007-04-02

申请人： Koji Funazaki ,  Hisatomi Kojima ,  Naoya Hayashi ,  Masayuki Yokoi

发明人： Koji Funazaki ,  Hisatomi Kojima ,  Naoya Hayashi ,  Masayuki Yokoi

IPC分类号： B32B5/00 ,  B29C47/00 ,  B24B1/00

CPC分类号： H01L21/304 ,  B32B27/32 ,  C09J7/243 ,  C09J7/29 ,  C09J2201/162 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/114 ,  C09J2423/046 ,  C09J2431/006 ,  C09J2433/006 ,  H01L21/67132 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/24355

摘要： The present invention provides a surface-protection tape for semiconductor wafers having an even thickness accuracy, excellent surface smoothness, and excellent surface sliding properties such as freedom from blocking, etc., and a substrate film for the surface-protection tape. The substrate film for the surface-protection tape for semiconductor wafers has at least one layer containing a polyethylene-based resin and satisfies the following requirements:(1) the back and front surfaces of the substrate film have a surface roughness Ra measured based on JIS B0601 of not more than 0.8 μm, and at least one surface thereof has a surface roughness Ra of not less than 0.05 μm; and(2) the difference between the maximum and minimum thicknesses of the substrate film is not more than 4 μm.The present invention also provides a surface-protection tape for semiconductor wafers comprising the substrate film and an adhesive layer.

摘要翻译： 本发明提供了一种用于半导体晶片的表面保护带，其具有均匀的厚度精度，优异的表面平滑度和优异的表面滑动性能，例如无阻挡等，以及用于表面保护带的基片膜。 用于半导体晶片的表面保护带的基材膜具有至少一层含有聚乙烯类树脂的层，并满足以下要求：（1）基材膜的背面和表面的表面粗糙度Ra为JIS B0601不大于0.8μm，并且其至少一个表面的表面粗糙度Ra不小于0.05μm; 和（2）基底膜的最大和最小厚度之差不大于4μm。 本发明还提供了一种用于半导体晶片的表面保护带，其包括基底膜和粘合剂层。