公开(公告)号：US5035744A

公开(公告)日：1991-07-30

申请号：US550305

申请日：1990-07-09

申请人： Koji Nishiyama ,  Masayuki Yamazaki ,  Takeshi Tsukuda ,  Youtaro Arai

发明人： Koji Nishiyama ,  Masayuki Yamazaki ,  Takeshi Tsukuda ,  Youtaro Arai

IPC分类号： C23C18/44

CPC分类号： C23C18/44

摘要： An electroless gold plating solution containing 0.1 to 10 ml/l of ethyleneamines and 0.1 to 10 g/l of hexamethylenetetramine as complexing agents in addition to the solution comprising water-soluble gold salts, pH controlling agents, catalysts, alkylamine boranes, alkali cyanides and ethylendiamine tetraacetic acid.According to the present invention, thick coating of a gold plating film having high quality and gloss is possible and the plating time becomes very short.

摘要翻译： 除了包含水溶性金盐，pH控制剂，催化剂，烷基胺硼烷，碱金属氰化物和碱金属氰化物的溶液之外，还含有0.1-10ml / l的乙撑胺和0.1-10g / l六亚甲基四胺作为络合剂的无电镀金液 乙二胺四乙酸。 根据本发明，可以实现具有高质量和光泽的镀金膜的厚涂层，并且电镀时间变得非常短。