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公开(公告)号:US20220216338A1
公开(公告)日:2022-07-07
申请号:US17522851
申请日:2021-11-09
Inventor: Sanghyeon KIM , Hyeongrak LIM
IPC: H01L29/78 , H01L29/66 , H01L21/762
Abstract: Disclosed are a growth structure for a strained channel, and a strained channel using the same and a method of manufacturing a device using the same. The growth structure for a strained channel includes a support substrate, a strain-relaxed buffer (SRB) layer disposed on a support substrate, a base growth layer grown to have one composition on the SRB layer, and a strained channel layer grown to have another composition on the base growth layer. The strained channel layer may include at least one of a tensile-strained channel layer or a compressively strained channel layer.