公开(公告)号：US20230236368A1

公开(公告)日：2023-07-27

申请号：US17684895

申请日：2022-03-02

Applicant: Korea Advanced Institute of Science and Technology

Inventor： Hyo-Hoon Park ,  HyunHo Yun ,  Jaeyong Kim

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/42

Abstract: An optical module package using a bidirectional polished silica optical waveguide is disclosed. An optical module package may include a planar optical waveguide that connects at least one aperture of each of the optical components and including inclined surfaces at both ends thereof to allow light, which exits from at least one aperture of any one optical component of the optical components to be subjected to optical coupling in a vertical direction through total reflection on an inclined surface corresponding to the at least one aperture of the any one optical component to cause the light to travel in a horizontal direction, and allows the light to be subjected to optical coupling to at least one aperture of a remaining optical component in the vertical direction through total reflection on the inclined surface corresponding to the at least one aperture of the remaining optical component.