公开(公告)号：US11628660B2

公开(公告)日：2023-04-18

申请号：US17177943

申请日：2021-02-17

Applicant: Korea Institute of Science and Technology

Inventor： Phillip Lee ,  Seungjun Chung ,  Jeong Gon Son ,  Jai Kyeong Kim ,  Heesuk Kim ,  Suk Joon Hwang ,  Byung Soo Kang

IPC: B32B37/12 ,  B32B7/022 ,  B32B38/08 ,  B32B38/00 ,  H05K1/02 ,  H05K1/03

Abstract: Disclosed is a method of manufacturing a stretchable substrate according to various embodiments of the present disclosure for realizing the above-described objectives. The method may include generating an auxetic including a plurality of unit structures and adhering one or more elastic sheets to one surface of the auxetic.