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公开(公告)号:US20220162060A1
公开(公告)日:2022-05-26
申请号:US17343667
申请日:2021-06-09
Applicant: Korea Institute of Science and Technology
Inventor: Seungjun CHUNG , Phillip LEE , Jeong Gon SON , Heesuk KIM , Jai Kyeong KIM , Seunghyun LEE , Byeongmoon LEE
IPC: B81C1/00
Abstract: Provided is a method of manufacturing a stretchable substrate according to various embodiments of the present disclosure in order to implement the above-described objects. The method may include forming an auxetic including a plurality of unit structures and forming one or more microstructures.