公开(公告)号：US11968778B2

公开(公告)日：2024-04-23

申请号：US17703520

申请日：2022-03-24

Applicant: Korea Institute of Science and Technology

Inventor： Phillip Lee ,  SeungJun Chung ,  HeeSuk Kim ,  JeongGon Son ,  SukJoon Hwang

IPC: H05K1/02 ,  A41D1/00 ,  A41D1/06 ,  A41D13/00 ,  A41D13/05 ,  A42B1/041 ,  A42B1/08 ,  A42B1/22 ,  A43B23/28 ,  B32B38/08 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0283 ,  H05K3/00 ,  H05K2201/09063

Abstract: Disclosed is a method of manufacturing a stretchable substrate having improved stretch uniformity according to various embodiments of the present disclosure in order to implement the above-described object. The method may include forming an auxetic including a plurality of unit structures, and attaching one or more elastic sheets to the auxetic and forming a stretchable substrate.

公开(公告)号：US11844175B2

公开(公告)日：2023-12-12

申请号：US17703277

申请日：2022-03-24

Applicant: Korea Institute of Science and Technology

Inventor： Phillip Lee ,  SeungJun Chung ,  HeeSuk Kim ,  JeongGon Son ,  SukJoon Hwang

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  A41D1/00 ,  A41D1/06 ,  A41D13/00 ,  A41D13/05 ,  A42B1/08 ,  A42B1/22 ,  A42B1/041

CPC classification number: H05K1/0283 ,  H05K3/00 ,  H05K2201/09063

Abstract: Disclosed is a method of manufacturing a stretchable substrate having improved stretch uniformity according to various embodiments of the present disclosure in order to implement the above-described object. The method may include forming an auxetic including a plurality of unit structures, and attaching one or more elastic sheets to the auxetic and forming a stretchable substrate.