公开(公告)号：US06277510B1

公开(公告)日：2001-08-21

申请号：US09479971

申请日：2000-01-10

申请人： Kun-Huang Chang ,  Wei-Wen Yeh ,  Shu-Chin Chou ,  Chen-Ron Lin

发明人： Kun-Huang Chang ,  Wei-Wen Yeh ,  Shu-Chin Chou ,  Chen-Ron Lin

IPC分类号： H01M810

CPC分类号： H01C1/1406 ,  H01C7/02

摘要： The present invention provides a porous electrode used for a conductive material-filled polymer composite. At least one surface of the porous electrode is an open porous structure, which includes a plurality of macropores and micropores randomly distributed and interconnected with each other. The conductive material-filled polymer composite includes a polymer substrate and conductive particles filled therein. When the surface of the open porous structure of the porous electrode is bonded with the conductive material-filled polymer composite, the conductive particles in the conductive material-filled polymer composite can be trapped in the macropores of the porous structure, and the polymer substrate in the conductive material-filled polymer composite can be immersed into the micropores of the porous structure. This enables a better direct contact between the conductive particles and the porous electrode. There is good adhesion strength between the porous electrode and the conductive material-filled polymer composite, and the interfacial resistance is decreased.

摘要翻译： 本发明提供一种用于导电材料填充的聚合物复合材料的多孔电极。 多孔电极的至少一个表面是开放的多孔结构，其包括彼此随机分布和互连的多个大孔和微孔。 导电材料填充的聚合物复合材料包括聚合物基材和填充在其中的导电颗粒。 当多孔电极的开放多孔结构的表面与导电材料填充的聚合物复合材料结合时，导电材料填充的聚合物复合材料中的导电颗粒可以被捕获在多孔结构的大孔中，并且聚合物衬底 导电材料填充的聚合物复合材料可以浸入多孔结构的微孔中。 这使得能够更好地直接接触导电颗粒和多孔电极。 多孔电极和导电材料填充的聚合物复合材料之间具有良好的粘合强度，并且界面电阻降低。