公开(公告)号：US20200005994A1

公开(公告)日：2020-01-02

申请号：US16020035

申请日：2018-06-27

申请人： Kyu-Oh LEE ,  Rahul JAIN ,  Sai VADLAMANI ,  Cheng XU ,  Ji Yong PARK ,  Junnan ZHAO ,  Seo Young KIM

发明人： Kyu-Oh LEE ,  Rahul JAIN ,  Sai VADLAMANI ,  Cheng XU ,  Ji Yong PARK ,  Junnan ZHAO ,  Seo Young KIM

IPC分类号： H01F27/32 ,  H01F27/28 ,  H01L23/498 ,  H01F41/04 ,  H01L21/48

摘要： Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.

公开(公告)号：US20170271264A1

公开(公告)日：2017-09-21

申请号：US15503658

申请日：2014-09-19

申请人： Kyu-Oh LEE

发明人： Kyu-Oh LEE

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L21/683 ,  H01L23/498 ,  H01L21/48

摘要： Semiconductor packages with embedded bridge interconnects, and related assemblies and methods, are disclosed herein. In some embodiments, a semiconductor package may have a first side and a second side, and may include a bridge interconnect, embedded in a build-up material, having a first side with a plurality of conductive pads. The semiconductor package may also include a via having a first end that is narrower than a second end. The bridge interconnect and via may be arranged so that the first side of the semiconductor package is closer to the first side of the bridge interconnect than to the second side of the bridge interconnect, and so that the first side of the semiconductor package is closer to the first end of the via than to the second end of the via. Other embodiments may be disclosed and/or claimed.