公开(公告)号：US20070193573A1

公开(公告)日：2007-08-23

申请号：US11542108

申请日：2006-10-04

申请人： Kyung-Tae Kim ,  Chul-Hwan Choi ,  Kyung-Tae Kim ,  Jun-Woo Choi

发明人： Kyung-Tae Kim ,  Chul-Hwan Choi ,  Kyung-Tae Kim ,  Jun-Woo Choi

IPC分类号： F24J1/00 ,  F24J3/00

CPC分类号： C23C16/4412 ,  C23C14/564 ,  F16K1/22 ,  H01L21/67017

摘要： Semiconductor device manufacturing equipment has a vacuum system that enhances the fluency of the gas being discharged from a chamber of the equipment. The vacuum system has a vent line, and a throttle valve that includes a vent line opening and closing member oriented so that it is readily opened by a concentrated flow of gas in the vent line. The vacuum system may include a heating unit that heats the vent line through which the gas passes. Still further, a bend in the vent line upstream of the vent line opening and closing member may have a gently curved shape and/or may subtend an angle of less than 90°. As a result, the efficiency of the ventilation of the process chamber is improved, making it easier to control the pressure of the process chamber and minimizing the contamination of the throttle valve and the vent line.

摘要翻译： 半导体器件制造设备具有提高从设备的室排出的气体的流畅性的真空系统。 真空系统具有排气管线和节流阀，该节流阀包括排气管路开闭部件，其定向成容易通过排气管线中的浓缩的气流打开。 真空系统可以包括加热单元，加热气体通过的排放管线。 此外，通气线打开和关闭部件上游的通气线的弯曲部可以具有轻微弯曲的形状和/或可以对着小于90°的角度。 结果，提高了处理室的通风效率，使得更容易控制处理室的压力并最小化节流阀和排气管线的污染。

公开(公告)号：US20070072489A1

公开(公告)日：2007-03-29

申请号：US11402822

申请日：2006-04-13

申请人： Kyung-Tae Kim ,  Jun-Woo Choi ,  Chul-Hwan Choi

发明人： Kyung-Tae Kim ,  Jun-Woo Choi ,  Chul-Hwan Choi

IPC分类号： H01R13/66

CPC分类号： H01R13/005 ,  H01L21/6719 ,  H01R4/56 ,  H01R4/66

摘要： Semiconductor device manufacturing equipment is installed using a mock-up of the equipment. First, a full-scale layout drawing of the equipment is prepared. Also, a mock-up of the equipment is fabricated. The mock-up has wiring and pipe connectors of the same type as those of the main equipment. The layout drawing is placed on the floor of the site at which the main equipment is to be installed. Then the mock-up is placed at the same location where the main equipment is to be installed, as represented in the layout drawing, with the wiring and pipe connectors of the mock-up located at the same positions where the wiring and pipe connectors of the main equipment will be located. The wiring and piping of the semiconductor manufacturing equipment is installed, and ends of the wiring and piping are connected to the wiring and pipe connectors of the mock-up. Then the wiring and piping are inspected. Subsequently, the mock-up is disassembled and removed, and the main equipment is set in place at the same location from which the mock-up was removed. Finally, the wiring and piping are connected with the wiring and pipe connectors of the main equipment. Thus, the semiconductor device manufacturing equipment can be quickly placed in operation once the main, apparatus of the equipment is procured.

摘要翻译： 使用设备的模型安装半导体器件制造设备。 首先，准备了设备的全尺寸布局图。 此外，制造了设备的模型。 该模型具有与主设备相同类型的接线和管接头。 布置图放在主要设备安装地点的地板上。 然后将模型放置在主要设备安装的相同位置，如布置图所示，模型的布线和管道连接器位于相同位置，其中布线和管道连接器 主要设备将位于。 安装半导体制造设备的布线和管道，将布线和管道的末端连接到模型的布线和管道连接器。 然后检查接线和管道。 随后，将模型拆卸拆卸，并将主设备放置在拆除模型的同一位置。 最后，配线和管道与主设备的接线和管接头连接。 因此，一旦采购了设备的主要设备，半导体器件制造设备就可以快速地投入运行。