公开(公告)号：US20180012822A1

公开(公告)日：2018-01-11

申请号：US15543922

申请日：2015-12-30

申请人： LAPPEENRANNAN TEKNILLINEN YLIOPISTO

发明人： Mika LOHTANDER ,  Leevi PAAJANEN ,  Tapani SIIVO ,  Antti JORTIKKA ,  Hannu YLISIURUA ,  Emma PAASONEN ,  Jyrki MONTONEN

IPC分类号： H01L23/473 ,  H01L23/10 ,  H01L21/48

CPC分类号： H01L23/473 ,  H01L21/4871 ,  H01L23/04 ,  H01L23/053 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor module includes a baseplate, a cover element attached to the baseplate so that detaching the cover element from the baseplate requires material deformations, and a semiconductor element in a room defined by the baseplate and the cover element. The semiconductor element is in a heat conductive relation with the baseplate and an outer surface of the baseplate is provided with laser machined grooves suitable for conducting heat transfer fluid. The laser machining makes it possible to make the grooves after the semiconductor module has been assembled. Therefore, regular commercially available semiconductor modules can be modified, with the laser machining, to semiconductor modules as disclosed.