公开(公告)号：US20230387069A1

公开(公告)日：2023-11-30

申请号：US17976133

申请日：2022-10-28

申请人： LASERSSEL CO., LTD.

发明人： Jae Joon CHOI ,  Byung Roc KIM ,  Eun Sung CHOI ,  Hwan Soo YEO ,  Seung Hyun SEO

IPC分类号： H01L23/00

CPC分类号： H01L24/75 ,  H01L2224/75102 ,  H01L2224/75263 ,  H01L2224/75301

摘要： The present invention relates to a laser reflow apparatus. More particularly, the present invention relates to a compression-type laser reflow apparatus with a vacuum chamber that enables mass processing by simultaneously pressuring and reflowing a plurality of electronic components by performing a laser reflow process by pressing with a light-transmitting pressing member and irradiating a laser beam inside the vacuum chamber, and that effectively prevents the generation of voids by fumes during soldering, so that the defect rate of the laser reflow process is greatly improved.