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公开(公告)号:US20230132546A1
公开(公告)日:2023-05-04
申请号:US17453396
申请日:2021-11-03
发明人: Cheng Zhu , Eric B. Duoss , Zhen Qi , Tony W. Van Buuren , Marcus A. Worsley
IPC分类号: B22F10/18 , B22F10/80 , B22F3/11 , B33Y10/00 , B33Y30/00 , H01M4/04 , H01M4/134 , B33Y80/00 , B33Y50/00
摘要: Freeform fabrication of architected porous zinc via 3D printing. Ink including zinc powders, solvents and binders is created with printability. At least one 3D model is created with microarchitectures. Extrusion-based direct-writing is used to manufacture free-standing 3D zinc structures. Post-processing conditions generate final architected porous zinc products.