公开(公告)号：US09316381B2

公开(公告)日：2016-04-19

申请号：US14630255

申请日：2015-02-24

Applicant: LG DISPLAY CO., LTD.

Inventor： Young-Min Kweon ,  Ji-Woon Min ,  Ho-Young Cheon

IPC: F21V19/00 ,  G02F1/1333 ,  G02F1/1335 ,  F21V8/00 ,  F21Y103/00

CPC classification number: F21V19/0025 ,  F21Y2103/10 ,  F21Y2115/10 ,  G02B6/0051 ,  G02B6/0073 ,  G02B6/0083 ,  G02B6/0091 ,  G02B6/0093 ,  G02F1/133308 ,  G02F1/133603 ,  G02F1/133615 ,  G02F2001/133314 ,  G02F2001/13332 ,  H05K2201/10106

Abstract: A light emitting diode assembly includes: a light emitting diode (LED) printed circuit board (PCB) having a base layer, an insulating layer on the base layer and a circuit pattern layer on the insulating layer, the LED PCB including a plurality of through holes spaced apart from each other; and a plurality of light emitting diodes (LEDs) inserted into the plurality of through holes, respectively, from a bottom surface of the LED PCB, each of the plurality of LEDs including a lead contacting the circuit pattern layer.