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公开(公告)号：US10789869B2
公开(公告)日：2020-09-29
申请号：US16155705
申请日：2018-10-09
Applicant: LG Display Co., Ltd.
Inventor： Jaesung Jeon , Daekyung Kim , Eunbyul Kim
Abstract: Disclosed herein is a chip-on-film including: a base film; a driver mounted on one of upper and lower surfaces of the base film; and at least one pad group, which includes signal wiring lines disposed on the upper and lower surfaces of the base film and transmitting signals via two paths, a first pad and a second pad disposed on one of the upper and lower surfaces of the base film, and a plurality of through-holes disposed between the first pad and the second pad and electrically connecting the signal wiring lines to each other, wherein the first pad and the second pad are separated a predetermined distance from each other in a width direction of the base film, and each of the first pad and the second pad is obliquely arranged in plural in a longitudinal direction of the base film.
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公开(公告)号：US11189207B2
公开(公告)日：2021-11-30
申请号：US17004657
申请日：2020-08-27
Applicant: LG Display Co., Ltd.
Inventor： Jaesung Jeon , Daekyung Kim , Eunbyul Kim
Abstract: Disclosed herein is a chip-on-film including: a base film; a driver mounted on one of upper and lower surfaces of the base film; and at least one pad group, which includes signal wiring lines disposed on the upper and lower surfaces of the base film and transmitting signals via two paths, a first pad and a second pad disposed on one of the upper and lower surfaces of the base film, and a plurality of through-holes disposed between the first pad and the second pad and electrically connecting the signal wiring lines to each other, wherein the first pad and the second pad are separated a predetermined distance from each other in a width direction of the base film, and each of the first pad and the second pad is obliquely arranged in plural in a longitudinal direction of the base film.
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