Contact Hole Assembly and Electronic Device

    公开(公告)号:US20250120017A1

    公开(公告)日:2025-04-10

    申请号:US18904494

    申请日:2024-10-02

    Inventor: Hyeon-Sik Cho

    Abstract: Embodiments of the disclosure relate to a contact hole assembly and an electronic device and may, more specifically, provide a contact hole assembly comprising a first metal layer to which an electrical signal is input, an insulation layer formed on the first metal layer, a second metal layer formed on the insulation layer and outputting the electrical signal, and a contact hole electrically connecting the first metal layer and the second metal layer, wherein the contact hole includes a via area penetrating the insulation layer, a conductor formed in the via area, and a recess area where a portion of a surface of the conductor is removed.

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