公开(公告)号：US20210339964A1

公开(公告)日：2021-11-04

申请号：US17270725

申请日：2019-08-23

Applicant: LG Display Co., Ltd.

Inventor： Dahl-Young KHANG ,  Sung-Hwan HWANG ,  Jia LEE ,  Sung-Soo YOON ,  Su Seok CHOI ,  Kiseok CHANG ,  Jeong Min MOON ,  Soon Shin JUNG ,  Sungpil RYU ,  Jihwan JUNG

IPC: B65G47/90 ,  H01L21/677

Abstract: A transportation head for a microchip transfer device capable of minimizing mechanical and chemical damage to a microchip, a microchip transfer device having same, and a transfer method thereby, and the transportation head includes a head body having a pickup area and a dummy area; a first protruding pin disposed in the pickup area of the head body; and a liquid droplet attached to the first protruding pin.