公开(公告)号：US10741615B2

公开(公告)日：2020-08-11

申请号：US15856423

申请日：2017-12-28

Applicant: LG Display Co., Ltd.

Inventor： Mingu Cho ,  Dojin Kim ,  Miae Kim

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/00

Abstract: A display device is disclosed. The display device includes a substrate including first to fourth subpixels, a first buffer layer positioned on the substrate, the first buffer layer including a silicon nitride layer and a silicon oxide layer, and a thin film transistor and an organic light emitting diode positioned on the first buffer layer. Each of the first to fourth subpixels includes an emission portion and a non-emission portion. A thickness of the silicon nitride layer in the non-emission portion is greater than a thickness of the silicon nitride layer in the emission portion.

公开(公告)号：US10446789B2

公开(公告)日：2019-10-15

申请号：US16278077

申请日：2019-02-16

Applicant: LG Display Co., Ltd.

Inventor： Eunah Kim ,  Miae Kim

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/00 ,  H01L51/56

Abstract: A display device and a method of manufacturing a display device are provided. A display device includes a substrate; a display area on the substrate and configured to display an image; a pad portion on at least one edge of the substrate, the pad portion including at least one sink portion; an anisotropic conductive film on the pad portion and filling the at least one sink portion, the anisotropic conductive film spaced apart from an end of the substrate; and a flexible printed circuit board on the anisotropic conductive film and electrically connected to the pad portion.

公开(公告)号：US10224503B2

公开(公告)日：2019-03-05

申请号：US15392076

申请日：2016-12-28

Applicant: LG Display Co., Ltd.

Inventor： Eunah Kim ,  Miae Kim

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/00 ,  H01L51/56

Abstract: A display device and a method of manufacturing a display device are provided. A display device includes a substrate; a display area on the substrate and configured to display an image; a pad portion on at least one edge of the substrate, the pad portion including at least one sink portion; an anisotropic conductive film on the pad portion and filling the at least one sink portion, the anisotropic conductive film spaced apart from an end of the substrate; and a flexible printed circuit board on the anisotropic conductive film and electrically connected to the pad portion.