公开(公告)号：US11316139B2

公开(公告)日：2022-04-26

申请号：US16709569

申请日：2019-12-10

Applicant: LG Display Co., Ltd.

Inventor： IkHyun Kuon ,  Yongsoo Kim ,  SangEun Han ,  SungNam Byun ,  JeongKweon Park ,  SangGul Lee ,  Changmin Pyo ,  Doowon Seo ,  Bogyung Kang ,  Sungwook Park ,  Juyeob Lee ,  YongMin Ha ,  SoonBum Shin ,  MoonGoo Kim ,  Chan Park ,  YunMi Lee

IPC: H01L27/32 ,  H01L51/52 ,  G09F9/30 ,  H01L51/56 ,  G06F1/16 ,  H01L51/00

Abstract: A manufacturing apparatus is configured to bond a display panel to a cover window having a flat portion between a first curvature portion and a second curvature portion. The manufacturing apparatus comprises a first attachment portion configured to press a first adhesive surface of the display panel to the flat portion of the cover window, and a 3D attachment portion configured to press a first edge adhesive surface and a second edge adhesive surface of the display panel to the first curvature portion and the second curvature portion of the window, respectively, and not press the first adhesive surface of the display panel.

公开(公告)号：US11191163B2

公开(公告)日：2021-11-30

申请号：US16706488

申请日：2019-12-06

Applicant: LG Display Co., Ltd.

Inventor： TaeWoo Lee ,  HeeSeok Noh ,  Sungwook Park

IPC: H05K1/00 ,  H05K1/18 ,  G06F3/041

Abstract: A flexible printed circuit board with improved ground efficiency is disclosed, and a flexible display module and an electronic device comprising the same is disclosed, wherein the flexible printed circuit board comprises a flexible circuit film having a circuit layer disposed on one surface of a base film, and a ground pad portion disposed on another surface of the base film; and a conductive cover member configured to cover the other surface of the base film and electrically connected with the ground pad portion, wherein the conductive cover member includes a cutting portion overlapped with the ground pad portion.