公开(公告)号：US20130135540A1

公开(公告)日：2013-05-30

申请号：US13689448

申请日：2012-11-29

Applicant: LG Display Co., Ltd.

Inventor： Seunghee NAM ,  Woosup SHIN ,  Soonsung YOO ,  Namkook KIM

IPC: G02F1/1362

CPC classification number: G02F1/136286 ,  G02F1/13338 ,  G02F1/134363 ,  G06F3/0412 ,  G06F3/044

Abstract: A liquid crystal display device including a touch panel having a simple structure and minimized thickness is provided. The liquid crystal display (LCD) device according to an embodiment includes a liquid crystal panel and a touch panel structure. The liquid crystal panel includes a thin film transistor (TFT) array substrate, a color filter substrate having a black matrix therein, and a liquid crystal layer disposed between the TFT array substrate and the color filter substrate. The touch panel structure includes at least one touch sensor. Each touch sensor includes a first electrode disposed within the liquid crystal panel, and a second electrode disposed outside the liquid crystal panel.

Abstract translation: 提供了一种包括具有简单结构和最小厚度的触摸面板的液晶显示装置。 根据实施例的液晶显示器（LCD）装置包括液晶面板和触摸面板结构。 液晶面板包括薄膜晶体管（TFT）阵列基板，其中具有黑矩阵的滤色器基板和设置在TFT阵列基板和滤色器基板之间的液晶层。 触摸面板结构包括至少一个触摸传感器。 每个触摸传感器包括设置在液晶面板内的第一电极和设置在液晶面板外部的第二电极。

公开(公告)号：US20190103448A1

公开(公告)日：2019-04-04

申请号：US16146126

申请日：2018-09-28

Applicant: LG Display Co., Ltd.

Inventor： Hangsup CHO ,  Seongeun PARK ,  Woosup SHIN ,  Hyeonwoo LEE ,  Bongchul KIM

IPC: H01L27/32 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56

Abstract: A flexible display device and a method for manufacturing a flexible display device are provided. A flexible display device includes: a support substrate having a first thickness and including a first material, the support substrate further including first and second main faces opposite to each other, a buffer substrate on the first main face of the support substrate, the buffer substrate having a second thickness smaller than the first thickness, and the buffer substrate including a second material more flexible than the first material, a thin-film transistor array on the buffer substrate, such that the buffer substrate is between the thin-film transistor array and the support substrate, and a sealing substrate fixed above the thin-film transistor array, the thin-film transistor array being between the buffer substrate and the sealing substrate.