公开(公告)号：US20190085433A1

公开(公告)日：2019-03-21

申请号：US15903433

申请日：2018-02-23

Applicant: LG ELECTRONICS INC.

Inventor： Myeon Chang Sung ,  Joongnyon Kim ,  Sunghyun Park ,  Vyacheslav E. Bazhenov ,  Andrey V. Koltygin

IPC: C22C23/04 ,  H01L23/373

Abstract: A magnesium (Mg) alloy having lightweight and excellent thermal conductivity, and a heat sink including the magnesium (Mg) alloy are provided. The magnesium (Mg) alloy may include one or more alloy additive elements selected from the group consisting of silicon (Si), calcium (Ca), tin (Sn), yttrium (Y), iron (Fe), nickel (Ni), copper (Cu), cerium (Ce), cesium (Cs), antimony (Sb), cobalt (Co), thorium (Th), and silver (Ag). Some of the alloy additive elements may be dissolved in the magnesium alloy to form a solid solution. The alloy additive elements that form the solid solution at room temperature may account for 2 wt % or less, based on the total weight (100 wt %) of the magnesium alloy, and the alloy additive elements that do not form the solid solution may be in crystalline phases.