公开(公告)号：US20240006758A1

公开(公告)日：2024-01-04

申请号：US18255288

申请日：2021-12-06

Applicant: LG ELECTRONICS INC.

Inventor： Doojung KIM ,  Seungmin WOO ,  Dongwan ROH

IPC: H01Q1/52 ,  H01Q9/04 ,  H04B1/00 ,  H04B1/40

CPC classification number: H01Q1/526 ,  H01Q9/0421 ,  H04B1/0064 ,  H04B1/40 ,  H01Q1/2291

Abstract: A communication module according to the present embodiment comprises: a substrate in which a ground shield protrudes from a main body; at least one communication chip provided in the main body; a first antenna having a first feeding unit and a first ground that are connected to the main body; and a second antenna which has a second feeding unit and a second ground that are connected to the main body, and which is spaced from the first antenna, wherein the ground shield protrudes between the first antenna and the second antenna, and at least one hole can be formed in the ground shield.