公开(公告)号：US20190313529A1

公开(公告)日：2019-10-10

申请号：US16380441

申请日：2019-04-10

Applicant: LG Electronics Inc.

Inventor： Jaehyuk KIM ,  Kyungcheol Paek ,  Chaejoo Lim

IPC: H05K1/11 ,  H05K1/02

Abstract: The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.

公开(公告)号：US20190131722A1

公开(公告)日：2019-05-02

申请号：US16095333

申请日：2017-01-20

Applicant: LG ELECTRONICS INC.

Inventor： Seungwoo RYU ,  Wonkyong CHOI ,  Taehoon KIM ,  Youngil KIM ,  Jaehyuk KIM ,  Chaejoo LIM ,  Joohee LEE ,  Wonwoo LEE

IPC: H01Q25/00 ,  H01Q1/24 ,  H01Q1/38

Abstract: The present invention relates to a mobile terminal comprising: a terminal body; a main circuit board disposed in the body; a main conductive member spaced apart from the main circuit board and radiating electromagnetic waves at an end thereof; and a frequency varying unit disposed between the main conductive member and the main circuit board so as to vary the resonant frequency of the main conductive member, wherein the frequency varying unit comprises: a power supply unit connected to the main circuit board; and one or more sub-conductive members disposed between the main conductive member and the power supply unit; spaced apart from each other, and supplied with power by the power supply unit, and wherein the sub-conductive members and the main conductive member are a predetermined distance apart from each other.