公开(公告)号：US12300767B2

公开(公告)日：2025-05-13

申请号：US17770934

申请日：2019-10-23

Applicant: LG ELECTRONICS INC.

Inventor： Jeomoh Kim ,  Younghak Chang

IPC: H01L33/38 ,  H01L25/075 ,  H10H20/01 ,  H10H20/831

Abstract: The present specification provides a red semiconductor light emitting element having no residual bonding layer when a semiconductor light emitting element is selectively transferred or assembled, and a method for manufacturing a display apparatus using same. The method for manufacturing the display apparatus according to an embodiment of the present disclosure comprises the steps of: forming an epitaxial layer for implementing a red semiconductor light emitting element on a growth substrate; transferring the epitaxial layer on the growth substrate onto a first temporary substrate; forming a release layer on the epitaxial layer which has been transferred onto the first temporary substrate; transferring the epitaxial layer, on which the release layer has been formed, onto a second temporary substrate; manufacturing an individual semiconductor light emitting element by etching the epitaxial layer transferred on the second temporary substrate; and separating the semiconductor light emitting element from the second temporary substrate.