公开(公告)号：US20210285665A1

公开(公告)日：2021-09-16

申请号：US17196231

申请日：2021-03-09

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon HA ,  Jongchul HA ,  Inbeom CHEON ,  Sunghoon BAEK

IPC: F24F3/153 ,  F24F3/14

Abstract: A method for manufacturing a heat transfer module for a dehumidifier may include forming a U shaped heat pipe having one straight portion acting as a heat-dissipation pipe, the other straight portion acting as a heat-absorbing pipe, and a connection pipe having a curved shape and connecting the two straight portions; inserting a heat-emitting fin and a heat-absorbing fin into the heat-dissipation pipe and the heat-absorbing pipe, respectively; expanding the heat-dissipation pipe and the heat-absorbing pipe such that the heat-emitting fin and the heat-absorbing fin are fixed to the heat-dissipation pipe and the heat-absorbing pipe, respectively; sealing one end of the heat pipe; injecting working fluid into the heat pipe through the other end of the heat pipe; and sealing the other end of the heat pipe containing therein the working fluid.