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公开(公告)号：US10342131B1
公开(公告)日：2019-07-02
申请号：US16041147
申请日：2018-07-20
Applicant: LG ELECTRONICS INC.
Inventor： Jaehyuk Kim , Kyungcheol Paek , Chaejoo Lim
Abstract: The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.
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公开(公告)号：US20190313529A1
公开(公告)日：2019-10-10
申请号：US16380441
申请日：2019-04-10
Applicant: LG Electronics Inc.
Inventor： Jaehyuk KIM , Kyungcheol Paek , Chaejoo Lim
Abstract: The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.
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公开(公告)号：US10595407B2
公开(公告)日：2020-03-17
申请号：US16380441
申请日：2019-04-10
Applicant: LG ELECTRONICS INC.
Inventor： Jaehyuk Kim , Kyungcheol Paek , Chaejoo Lim
Abstract: The present disclosure relates to a PCB laminated structure, including a first substrate; a second substrate disposed to overlap with the first substrate on the top and bottom; and an interposer assembly provided between the first substrate and the second substrate to allow electromagnetic connection between the first and second substrates, wherein the interposer assembly includes a housing configured to form a closed region along a top surface circumference of the first substrate and a bottom surface circumference of the second substrate to support the first and second substrates; a signal via connected to the first and second substrates, respectively, to transmit electromagnetic signals between the first substrate and the second substrate; and a ground via connected to the housing to serve as a ground, and spaced a set distance from the signal via at one side of the signal via.
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