公开(公告)号：US20220125246A1

公开(公告)日：2022-04-28

申请号：US17504038

申请日：2021-10-18

申请人： LG ELECTRONICS INC.

发明人： Namhun KIM ,  Kyungsoo Hwangbo

IPC分类号： A47J43/07 ,  G06F3/041 ,  A47J43/046

摘要： A blender includes a jar including a blade module to cut an object, a main body to receive the jar and including a motor to rotate the blade module, and a controller disposed inside the main body and configured to operate the motor. The main body further includes an outer case and forming an outer structure of the main body. The outer case includes a touch input portion on an outer surface of the outer case. A touch sensor is disposed on an inner surface of the outer case at a position corresponding to the touch input portion to detect a touch input on the touch input portion. The controller is configured to determine an operation time period of the motor based on the touch input detected by the touch sensor.

公开(公告)号：US11521778B2

公开(公告)日：2022-12-06

申请号：US16344767

申请日：2017-10-20

申请人： LG ELECTRONICS INC.

发明人： Hyungjun Kim ,  Kyungsoo Hwangbo

IPC分类号： H05B6/36 ,  H05B6/40 ,  H01F17/00 ,  H01F5/00 ,  H05K1/16 ,  H05B6/44

摘要： The coil substrate may include a substrate; a first conductor layer including a plurality of first and second segments periodically disposed on a top and a bottom of the substrate; a second conductor layer including a plurality of first and second segments periodically overlapping the first conductor layer on the top and the bottom of the substrate; a first connection line that connects the first and second segments of the first conductor layer; and a second connection line that connects the first and second segments of the second conductor layer. The first connection line includes a first region exposed on at least one of first and second surfaces that are opposite to each other of the substrate and second and third regions disposed through the substrate from both sides of the first region.

公开(公告)号：US11178732B2

公开(公告)日：2021-11-16

申请号：US16018835

申请日：2018-06-26

申请人： LG ELECTRONICS INC.

发明人： Kyungsoo Hwangbo ,  Bong Jin Cho

IPC分类号： H05B6/12 ,  H05B6/06

摘要： An induction heating device and a method for sensing a cooking vessel on an induction heating device are provided. The induction heating device may include a controller that converts a resonance waveform generated as current is applied to a sensing coil into a square waveform. The controller may determine whether a cooking vessel placed on the induction heating device has an inductive heating property based on a number of pulses of the converted square waveform.

公开(公告)号：US11153938B2

公开(公告)日：2021-10-19

申请号：US16018717

申请日：2018-06-26

申请人： LG ELECTRONICS INC.

发明人： Kyungsoo Hwangbo ,  Junbo Byun ,  Hyeonwoo Seo

IPC分类号： H05B6/06 ,  H05B1/02

摘要： A cooking vessel sensor and an induction heating device including a cooking vessel sensor is provided. The cooking vessel sensor may include a cylindrical hollow body having a first receiving space defined therein; a hollow cylindrical magnetic core received in the first space and having a second receiving space defined therein; and a sensing coil wound on an outer face of the side wall by a predetermined number of winding counts. The cylindrical hollow body may have a side wall having a coil outlet defined therein, and the sensing coil may pass through the coil outlet out of the body. The cooking vessel sensor may further include a controller that applies a current to the sensing coil and determines, based on a sensing result of the cooking vessel sensor, whether the cooking vessel is inductive or has an inductive heating property.